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The goal of this work is to evaluate the feasibility of soldering tin‐silver‐copper balled BGAs using tin‐lead‐based solder and to investigate the influence of different production parameters on the microstructure of the solder joint.

The soldering of the BGAs was done with various temperature profiles and two conveyor speeds under a nitrogen atmosphere in a full convection oven. One specimen from each temperature/time combination was cross‐sectioned. The cross sections were analysed with optical microscopy, scanning electron microscopy with energy dispersive X‐ray spectroscopy (SEM/EDS) at 30 kV and focused ion beam microscopy (FIB).

The cross sections show a metallurgical bond between the solder and the tin‐silver‐copper balls of the BGA, even at a peak reflow temperature of 210°C. However, the balls alloy only partially with the solder, as the liquidus of tin‐silver‐copper balls is 217°C. As soon as the peak temperature exceeds the liquidus of the ball, the solder is totally dissolved in the material of the ball. A reflow profile with a peak temperature of about 230°C on the BGA gives a homogenous reaction of the solder with the ball with a minimum formation of voids.

The dependence of varying reflow parameters on reliability requires detailed study. Especially the effect of a partially melted ball on the degradation of the solder joint needs to be investigated.

From the findings, it can be said that soldering lead‐free balls with tin‐lead solder is possible. This is useful during the transitional period that the industry is in at the moment. More and more component manufacturers are changing their components to lead‐free, often without notice to the customer. If a production line is still running a tin‐lead process it is essential to know how to process these components with tin‐lead solder.